We have seen strong customer acceptance of our electroplated wafer bumping technology, including our lead-free bump, as well as wafer probe capability, and we expect to continue to strategically expand these resources.

-James Kim

Select a background
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image
Awesome background image

More quotes by James Kim